Claiming to be able to find the faults missed by X-ray inspection systems, the 3D-Bga inspection system detects hard-to-find faults such as the presence of flux, micro cracks, and cold solder joints.

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

The YTX-3000, a high-resolution x-ray inspection system from YESTech (San Clemente, CA; www.yestechinc.com) performs automated inspection of BGA and flip-chip devices, solder joints, and bond wires.

The machine-based examination of products by scanning beneath their surfaces with x-rays. For example, automated x-ray inspection (AXI) is widely used to spot defects in BGA chip alignment on the ...

Memory module makers often use X-ray technology to inspect samples taken from a manufactured batch for abnormal soldering joints. BGA connections are not easily accessible from all sides and as a ...

Saki has upgraded its automated 3D x-ray inspection system (3D-AXI). “The 3Xi-M110 V3 model delivers cycle times of more than twice as fast as previously possible and the accuracy provided is ...

This video shows AOI ad X-ray inspection at Digicom. Inspection is taken very seriously at Digicom to ensure that no defective boards leave the factory. Every board is tested and inspections are done ...